Joshua Jacoby
About Joshua Jacoby
Joshua Jacoby is a Senior Failure Analysis Engineer at ON Semiconductor, where he has worked since 2020. He specializes in defect localization and physical analysis techniques for semiconductor devices, with a background in electrical and electronics engineering.
Work at ON Semiconductor
Joshua Jacoby has been employed at ON Semiconductor since 2014, progressing through various roles. He began as a Failure Analysis Engineer I from 2014 to 2018, where he developed foundational skills in semiconductor analysis. He advanced to Failure Analysis Engineer II from 2018 to 2020, further enhancing his expertise in defect localization and physical analysis techniques. Currently, he serves as a Senior Failure Analysis Engineer, a position he has held since 2020. His work focuses on electrical and physical characterization of circuits, as well as package and die level deprocessing techniques.
Education and Expertise
Joshua Jacoby holds a Bachelor of Science in Electrical and Electronics Engineering from the University of California, Santa Cruz, where he studied from 2010 to 2014. He furthered his education by obtaining a Master of Science in Engineering from the Ira A. Fulton Schools of Engineering at Arizona State University, completing his studies in 2020. His academic background has equipped him with a strong foundation in semiconductor technology, particularly in defect localization and physical analysis techniques.
Background
Before joining ON Semiconductor, Joshua Jacoby worked as a Student Technical Support Specialist at UC Santa Cruz from 2012 to 2014. This role provided him with valuable experience in technical support and problem-solving within an academic environment. His transition to ON Semiconductor marked the beginning of his career in the semiconductor industry, where he has since developed specialized skills.
Professional Development
Throughout his career at ON Semiconductor, Joshua Jacoby has focused on enhancing his skills in failure analysis and semiconductor device characterization. His roles have involved significant responsibilities in analyzing defects and improving processes related to semiconductor manufacturing. His expertise in package and die level deprocessing techniques has contributed to advancements in the field.