Jun Dela Cruz
About Jun Dela Cruz
Jun Dela Cruz is the Director of Reliability Engineering at onsemi, with extensive experience in the semiconductor industry spanning over three decades. He has held various engineering and management roles at notable companies, including Infineon Technologies, Fairchild, and Power Integrations.
Work at Onsemi
Jun Dela Cruz currently holds the position of Director of Reliability Engineering at onsemi, a role he has occupied since 2023. His responsibilities include overseeing reliability engineering initiatives within the organization, focusing on enhancing product reliability and performance. His work contributes to the development of robust semiconductor solutions in the San Francisco Bay Area.
Previous Experience in Reliability Engineering
Prior to his current role, Jun Dela Cruz accumulated extensive experience in reliability engineering across various organizations. He served as a Senior Reliability Engineering Manager at Power Integrations from 2021 to 2023. Before that, he worked as a Principal NPI Reliability Engineer at Fairchild for one year in 2015-2016 and held the position of Automotive, QA, Reliability Engineering Manager at Transphorm Inc. from 2016 to 2017.
Career at Infineon Technologies
Jun Dela Cruz has a significant history with Infineon Technologies, where he worked in various roles from 2003 to 2015. His tenure included positions as Reliability and Failure Analysis Manager in Tijuana, Mexico, and Senior Staff Reliability and Failure Analysis Engineer in Temecula, California. His experience at Infineon contributed to his expertise in reliability and failure analysis within the semiconductor industry.
Educational Background
Jun Dela Cruz earned a Bachelor of Science degree in Electronics and Communications from Saint Louis University in the Philippines. His studies spanned from 1988 to 1992, providing him with a solid foundation in electronics that supports his extensive career in reliability engineering.
Expertise in Reliability Engineering
Jun Dela Cruz possesses in-depth knowledge of semiconductor assembly and fabrication processes, as well as final test and package configurations. He has hands-on experience in establishing reliability and failure analysis labs, including equipment layout and procurement. His expertise extends to risk assessment analysis, utilizing life data analysis techniques such as Weibull plots and accelerated reliability testing.