Justin Yarmush
About Justin Yarmush
Justin Yarmush is a Process Engineering Manager specializing in Reactive Ion Etch and Metrology, currently working at onsemi in East Fishkill, New York. He has extensive experience in process engineering, having held managerial positions at GLOBALFOUNDRIES and IBM, and has a background in Chemical Engineering from Rensselaer Polytechnic Institute.
Work at Onsemi
Justin Yarmush currently serves as the Process Engineering Manager for Reactive Ion Etch & Metrology at Onsemi. He has been in this role since 2023, based in East Fishkill, New York. In his position, he manages a team focused on both process development and manufacturing control specifically for 300mm Reactive Ion Etch and Metrology tools. His responsibilities include overseeing tool qualifications and ensuring the efficiency of engineering processes.
Previous Experience at GLOBALFOUNDRIES
Before joining Onsemi, Justin Yarmush worked at GLOBALFOUNDRIES from 2019 to 2023 as Process Engineering Manager for Reactive Ion Etch. He spent four years in this role in East Fishkill, New York. Prior to that, he held the position of Senior Member of Technical Staff in Process Engineering at GLOBALFOUNDRIES from 2015 to 2019. His tenure at GLOBALFOUNDRIES contributed to his extensive experience in the semiconductor manufacturing industry.
Career at IBM
Justin Yarmush was employed at IBM as an Advisory Engineer from 2014 to 2015. During his ten-month tenure, he worked in Hopewell Junction, New York. This role added to his technical expertise and experience in engineering processes within the semiconductor sector.
Experience at Tokyo Electron US
Justin Yarmush began his career at Tokyo Electron US, where he worked as a Process Engineer from 2006 to 2014. His eight years in this role in Hopewell Junction, New York, provided him with foundational knowledge and skills in process engineering, particularly in the areas of reactive ion etching.
Education and Expertise
Justin Yarmush earned a Bachelor of Science degree in Chemical Engineering from Rensselaer Polytechnic Institute, where he studied from 2002 to 2006. His educational background, combined with his extensive experience in both Front End of Line (FEOL) and Back End of Line (BEOL) Reactive Ion Etch process development, establishes him as an expert in the field.