Kanjani Mody
About Kanjani Mody
Kanjani Mody is a Quality and Reliability Engineer at ON Semiconductor, where he has worked since 2018. He holds a Master of Engineering in Electrical Engineering from Boise State University and has experience in failure analysis and reliability testing.
Current Role at ON Semiconductor
Kanjani Mody has been employed as a Quality and Reliability Engineer at ON Semiconductor since 2018. In this role, Mody focuses on ensuring product reliability and quality through various engineering processes. Responsibilities include conducting reliability stress tests such as HTOL, T/C, Latch-up, ELFR, and HAST. Mody specializes in identifying high-risk failure modes early in the design life cycle for new product development, collaborating with engineering teams to develop and implement corrective actions to prevent failure recurrence.
Previous Experience at ON Semiconductor
Prior to the current position, Kanjani Mody worked at ON Semiconductor as a Product Engineering Intern from 2016 to 2017 in San Jose, California. This internship provided Mody with practical experience in product engineering, contributing to the development and testing of semiconductor products. Mody's experience in this role laid the groundwork for a deeper understanding of quality and reliability engineering.
Education and Expertise
Kanjani Mody earned a Master of Engineering in Electrical Engineering from Boise State University, studying from 2014 to 2017. During this time, Mody also served as a Graduate Research Assistant and a Graduate Teaching Assistant, gaining valuable experience in research and teaching. Mody's undergraduate studies were completed at Universal College of Engineering & Technology, where a Bachelor's degree in Electronics and Communication Engineering was obtained from 2010 to 2013. Mody's education emphasizes semiconductor technology and integrated circuit design.
Internship Experience
Kanjani Mody has completed several internships that contributed to professional development. In 2009, Mody interned at Electronics & Quality Development Centre in Gandhinagar for two months. This experience was followed by a three-month internship at Rutav Engitronic Systems in Gujarat in 2010. These internships provided foundational knowledge and skills in engineering practices.
Technical Skills and Techniques
Kanjani Mody utilizes advanced failure analysis techniques in the current role, including Hot spot analysis, photo-emission analysis, and chemical de-processing. Mody has expertise in CSP/iBGA packaging processes and is experienced in conducting reliability stress tests. This technical skill set supports Mody's focus on quality assurance and reliability in semiconductor products.