Kramer Liu
About Kramer Liu
Kramer Liu is a Principal Senior Engineer at ON Semiconductor, specializing in power and discrete device compact modeling. He has extensive experience in the semiconductor industry, having held key positions at companies such as ProPlus Design Solutions, NVIDIA, and SMIC.
Current Role at ON Semiconductor
Kramer Liu serves as a Principal Senior Engineer at ON Semiconductor, a position he has held since 2018 in Shanghai, China. In this role, he is involved in signal integration and package modeling, contributing to the development of advanced semiconductor technologies. He has also developed an AI-based SPICE model extraction flow, enhancing the efficiency and accuracy of modeling processes within the organization. His work focuses on power and discrete device compact modeling, utilizing various technologies such as Trench, SiC, IGBT, JBS, and GaN.
Previous Experience in the Semiconductor Industry
Prior to his current position, Kramer Liu accumulated extensive experience in the semiconductor industry. He worked at Synopsys as a Senior Device Modeling Engineer from 2005 to 2012, where he focused on device modeling techniques. He then joined SMIC as a Senior Engineer for one year in 2004. Following this, he held the position of Senior Software Engineer at NVIDIA from 2016 to 2017. Before that, he served as Technical Marketing Manager at ProPlus Design Solutions, Inc. in Shanghai from 2013 to 2015.
Educational Background in Electronics and Physics
Kramer Liu's educational background includes a PhD in Electronics from Shandong University, which he completed from 1997 to 2002. He also achieved a postdoctoral degree in Nano-electronics at Shanghai Jiao Tong University from 2002 to 2004. Earlier in his academic career, he earned a bachelor's degree in Physics from Hunan Normal University, studying from 1993 to 1997. This strong foundation in electronics and physics has equipped him with the necessary skills for his engineering roles.
Expertise in Semiconductor Modeling Technologies
Kramer Liu specializes in power and discrete device compact modeling, with a focus on various semiconductor technologies. His expertise includes Trench, SiC, IGBT, JBS, and GaN devices. He is also skilled in TCAD to SPICE simulation platform development, which is critical for accurate modeling and simulation in semiconductor design. His technical knowledge and experience contribute significantly to advancements in the field.