Lim Kok Shen
About Lim Kok Shen
Lim Kok Shen is a Device Engineer at ON Semiconductor in Negeri Sembilan, Malaysia, with over 15 years of experience in the semiconductor industry. He specializes in process improvements and yield enhancement for various technologies, including Diode and JFET.
Work at ON Semiconductor
Lim Kok Shen has been employed at ON Semiconductor as a Device Engineer since 2009. In this role, he has focused on enhancing manufacturing processes and improving device yields. His responsibilities include providing technical leadership in daily operations and implementing methodologies that streamline device transfers from both internal and external fabrication facilities. He has played a significant role in the qualification and transfer of JFET and Audio Transistor production to the Seremban fab, which has strengthened local manufacturing capabilities.
Education and Expertise
Lim Kok Shen completed his secondary education at Chung Hua High School Seremban, where he studied Science and achieved the Unified Examination Certificate (UEC) from 1999 to 2004. He furthered his education at Multimedia University, obtaining a degree in Electronic Engineering in 2009 after four years of study from 2005 to 2009. His academic background provides a solid foundation for his expertise in device engineering and manufacturing processes.
Background
Lim Kok Shen has a background in engineering with a focus on device manufacturing. He has over 15 years of experience in the semiconductor industry, specifically in roles that require technical leadership and process optimization. His work involves the application of statistical tools, such as JMP, to analyze data related to wafer probe and final test parameters, which aids in optimizing process flows.
Achievements
Throughout his career, Lim Kok Shen has contributed to various initiatives aimed at improving manufacturing efficiency and reducing costs. He developed and implemented a copy exact methodology for device transfers, which has been crucial for maintaining quality standards. Additionally, he has been involved in cost-saving projects, including the qualification of Reclean Substrate as a standard for production and participation in the Cu wire qualification project. His contributions have had a positive impact on the operational efficiency of the manufacturing processes.