Luigi Romano

Luigi Romano

Principal Manufacturing Engineer @ Onsemi

About Luigi Romano

Luigi Romano is a Principal Manufacturing Engineer at ON Semiconductor, specializing in CMOS image sensors and responsible for various FSI/BSI devices. He has a strong academic background in Physics and significant experience in wafer fab processes and sensor characterization.

Work at Onsemi

Luigi Romano has been employed at ON Semiconductor since 2016, serving as a Principal Manufacturing Engineer. In this role, he is responsible for overseeing the manufacturing processes of various devices, particularly focusing on FSI/BSI technologies. His work includes supporting the R&D team by developing advanced test flows for engineering characterization and conducting electrical failure analysis on the Magnum1 platform. His tenure at ON Semiconductor spans over eight years, during which he has contributed to the company's advancements in imaging technologies.

Education and Expertise

Luigi Romano studied at ITIS Ettore Majorana and later attended Università degli Studi di Napoli Federico II, where he focused on Physics from 1996 to 2002. His academic background has provided him with a solid foundation in the principles of physics, which he applies in his engineering work. He possesses extensive experience in CMOS image sensors, particularly in wafer fabrication processes, sensor characterization, and yield analysis, making him a knowledgeable professional in the field.

Background

Luigi Romano has a background that includes significant involvement in the integration of new products and intellectual property following the LFoundry acquisition of the Avezzano Facility in 2013. His role in this integration process has contributed to the development and enhancement of manufacturing capabilities within the organization. Additionally, he is the owner of the FLCOS micro display device, which showcases his expertise in advanced testing technologies.

Achievements

Throughout his career, Luigi Romano has played a key role in the development of various FSI/BSI devices used in applications such as camera phones, automotive technologies, and DSLRs. His contributions to the field of CMOS image sensors have been significant, particularly in wafer fab processes and yield analysis. He has gained expertise in the Nextest Magnum1/2 tester, which he utilizes to create new test programs, further enhancing the testing capabilities of the devices he works with.

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