Mac Masiris
About Mac Masiris
Mac Masiris is a Failure Analysis Technician IV at onsemi in the Philippines, where he has worked since 2013. He specializes in failure analysis techniques and has a background in Electro-Mechanical studies from Dualtech Training Center.
Work at Onsemi
Mac Masiris has been employed at Onsemi as a Failure Analysis Technician IV since 2013. In this role, he has focused on conducting thorough failure analyses and implementing corrective actions to resolve device failures. His responsibilities include completing 8D reports, which are structured problem-solving tools used to identify, correct, and eliminate recurring problems. Prior to this position, he worked as a Quality Assurance Engineering Technical Operator at Onsemi from 2010 to 2013, where he gained foundational experience in quality assurance processes.
Education and Expertise
Mac Masiris studied at Dualtech Training Center, where he earned an Associate's degree in Electro-Mechanical Technology from 2007 to 2010. This educational background provided him with a strong foundation in both mechanical and electrical systems. He has developed expertise in failure analysis techniques, including both non-destructive and destructive methods. His proficiency extends to advanced techniques such as Laser Ablation and Chemical Decapsulation, which are essential for analyzing and diagnosing device failures.
Background
Mac Masiris has a career spanning over a decade in the semiconductor industry, primarily with Onsemi. His journey began after completing his education at Dualtech Training Center, where he developed technical skills that he applied in various roles. His transition from a QA Engineering Technical Operator to a Failure Analysis Technician IV reflects his growth and adaptability within the organization. His work is centered in the Philippines, contributing to the company's operations in the region.
Achievements
Throughout his tenure at Onsemi, Mac Masiris has initiated projects and kaizen activities aimed at improving laboratory processes and reducing cycle times. He has implemented critical improvements to failure analysis techniques to align with advancements in device technologies. Additionally, he operates advanced fault isolation tools, including Photo Emission Microscopy (PEM) and Optical Beam Induced Resistance Change (OBIRCh), which are vital for effective failure analysis.