Mario Hipol
About Mario Hipol
Mario Hipol is a New Package Development Engineer II at onsemi with extensive experience in the electronics industry, including roles at Amkor Technology Philippines and Cirtek Electronics Corporation. He holds a BSECE from Saint Louis University and has pursued further studies in Radio Frequency Engineering and Cisco Network Administration.
Work at Onsemi
Mario Hipol serves as a New Package Development Engineer II at Onsemi, a role he has held since 2020. In this position, he collaborates with cross-functional teams, including business units, test engineers, operations, reliability engineers, and planning. His responsibilities encompass the entire new package development process, from feasibility studies to production release. He drives new technology initiatives at the assembly site, focusing on securing future opportunities and maintaining a competitive advantage.
Previous Experience in Electronics Engineering
Before joining Onsemi, Mario Hipol accumulated significant experience in the electronics sector. He worked at Amkor Technology Philippines as a Wirebond Process Engineer II from 2019 to 2020. Prior to that, he was an Assembly Process Engineer at Cirtek Electronics Corporation from 2018 to 2019. Additionally, he spent three years at ROHM Co., Ltd. as both a Front of Line Equipment Engineer and an Assembly Equipment Engineer from 2011 to 2014.
Education and Expertise
Mario Hipol has a solid educational background in engineering. He earned a Bachelor of Science in Electronics and Communications Engineering (BSECE) from Saint Louis University in the Philippines, completing his studies from 2005 to 2011. He also pursued further education at the Meralco Foundation Institute, where he achieved qualifications in Electricity, including Industrial Electrician in 2013 and Building Wiring Installation and Maintenance in 2015. Currently, he is studying Radio Frequency Engineering at RF Engineer Pilipinas and Cisco Network Administration at Mnet Solutions.
Technical Skills and Equipment Proficiency
Mario Hipol possesses extensive technical skills relevant to his role in package development. He conducts feasibility studies and cost model proposals as part of his work. He is proficient in operating specific equipment, including Kulicke and Soffa ICONN, Maxum, and Shinkawa UTC 1000 and UTC 5000. His involvement includes supporting the development of Silver wire and SOIC14 Copper clip, as well as the qualification of Copper Alloy wire (Bare Copper 2N) and the development of the new package TSSOP 24.