Michael Grubman
About Michael Grubman
Michael Grubman is a Digital Lead and Chip Architect at ON Semiconductor, with extensive experience in circuit design and embedded systems. He has worked at IBM in various engineering roles and holds degrees from Ort Braude College and Tel Aviv University.
Current Role at ON Semiconductor
Michael Grubman serves as the Digital Lead and Chip Architect at ON Semiconductor. He has held this position since 2018, contributing to the development of advanced semiconductor technologies. His role involves overseeing digital design projects and leading initiatives that focus on chip architecture. Grubman's expertise in embedded systems and digital signal processing enhances his contributions to the company's objectives in the semiconductor industry.
Work Experience at IBM
Michael Grubman has extensive experience at IBM, where he worked in various engineering roles from 2006 to 2014. His positions included Circuit Design Engineer, Mixed Signal Design Engineer, Register File Design Engineer, and SRAM Design Engineer. Throughout his eight years at IBM, he focused on different aspects of circuit design and contributed to multiple projects, enhancing his skills in digital and mixed-signal design.
Education and Expertise
Michael Grubman earned a Bachelor of Technology (BTech) from Ort Braude College between 2002 and 2006. He furthered his education by obtaining a Master of Science (MSc) from Tel Aviv University from 2013 to 2016. Grubman's academic background supports his expertise in I/O interfaces, including MIPI and SPI, as well as his specialization in designing embedded systems and crypto logic.
Involvement in Radar Systems and DSP Design
Michael Grubman has been involved in radar system design and digital signal processing (DSP) design throughout his career. His work in these areas reflects his technical capabilities and understanding of complex electronic systems. This involvement has contributed to his proficiency in developing innovative solutions in the semiconductor field.