Mohd Taufiq Efrizal

Mohd Taufiq Efrizal

Failure Analysis Engineer @ Onsemi

About Mohd Taufiq Efrizal

Mohd Taufiq Efrizal is a Failure Analysis Engineer at ON Semiconductor, where he has worked since 2016. He holds a Bachelor's degree in Electrical, Electronics and Communications Engineering from Universiti Sains Malaysia and possesses expertise in various analysis techniques, including X-Ray analysis and Scanning Electron Microscopy.

Work at ON Semiconductor

Mohd Taufiq Efrizal has been employed at ON Semiconductor as a Failure Analysis Engineer since 2016. In this role, he is responsible for conducting detailed analyses to identify the root causes of device failures. His work involves the use of advanced techniques and equipment to ensure the reliability and performance of semiconductor devices. He participates in 8D reports, which are structured problem-solving processes aimed at identifying the root causes of failures. Efrizal works in both day and night shifts to maintain continuous analysis operations.

Education and Expertise

Mohd Taufiq Efrizal earned his Bachelor's degree in Electrical, Electronics and Communications Engineering from Universiti Sains Malaysia, completing his studies from 2011 to 2015. His academic background provides a solid foundation for his expertise in failure analysis. He is qualified to perform X-Ray analysis to examine internal device structures and is skilled in fault isolation techniques, including Photoemission (PEM) and Optical Beam Induced Resistance Change (OBIRCH).

Background in Engineering

Prior to his current role, Mohd Taufiq Efrizal gained practical experience as a trainee at Seremban Engineering Berhad for three months in 2014. This early exposure to the engineering field contributed to his understanding of the industry and prepared him for his subsequent career in failure analysis. His educational and training experiences have equipped him with the necessary skills to excel in his current position.

Technical Skills and Techniques

Efrizal possesses a range of technical skills relevant to his role as a Failure Analysis Engineer. He is proficient in using Scanning Electron Microscopes (SEM) and conducting Energy-dispersive X-ray spectroscopy (EDX) analysis. Additionally, he is experienced in handling chemicals for decapsulation and deprocessing processes. He utilizes Scanning Acoustic Tomography (SAT) to verify delamination by layer, showcasing his capability in employing advanced analytical techniques.

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