Negil Joice Damayo
About Negil Joice Damayo
Negil Joice Damayo is a Package Development Engineer at ON Semiconductor in Cebu, Philippines, with expertise in wafer dicing parameters and package development. He holds a Bachelor of Science in Electronics Engineering from the University of Cebu and has contributed to various packaging processes and tooling designs since 2017.
Work at Onsemi
Negil Joice Damayo has been employed at ON Semiconductor as a Package Development Engineer since 2017. In this role, he has contributed to various projects related to package development and assembly processes. His responsibilities include establishing wafer dicing parameters for specific packages and supporting mechanical dicing evaluations for the development of thin die. His work focuses on improving package design and assembly efficiency.
Education and Expertise
Negil Joice Damayo earned a Bachelor of Science in Electronics Engineering from the University of Cebu in Lapulapu and Mandaue, completing his studies from 2011 to 2016. His educational background has provided him with a solid foundation in electronics and communications engineering, which he applies in his current role as a Package Development Engineer.
Background
Negil Joice Damayo has a background in package development engineering, with a focus on various assembly processes and tooling design. He has been involved in establishing processes for wafer dicing and has worked on the characterization and validation of assembly processes for different package types. His experience includes designing assembly tooling and qualifying new materials for die attachment.
Achievements
In his role, Negil Joice Damayo has played a key role in several significant projects. He established a ceramic dicing Process of Record for ceramic packages with redistribution layers. He also contributed to the development of the SPS4×6 package, which features a driver on clip stacked die. His work has enhanced the efficiency and effectiveness of package development at ON Semiconductor.