Neha Priyadarshini
About Neha Priyadarshini
Neha Priyadarshini is a Senior Engineer at onsemi, specializing in Analog IC Design for CMOS Image Sensors. She has pursued her education at prestigious institutions, including a Ph.D. from the Indian Institute of Technology, Delhi, and has extensive experience in hardware implementation and pixel design.
Work at Onsemi
Neha Priyadarshini has been employed at onsemi as a Senior Engineer since 2021. In this role, she has focused on various aspects of engineering related to CMOS image sensors. Her work involves hardware implementation and test chip characterization, contributing to the development of advanced imaging technologies. Neha's experience at onsemi spans three years, during which she has gained significant expertise in the field.
Education and Expertise
Neha Priyadarshini is currently pursuing a Doctor of Philosophy (Ph.D.) in Analog IC Design with a focus on CMOS Image Sensors at the Indian Institute of Technology, Delhi. She has previously earned a Bachelor of Technology (B.Tech.) in Electronics and Communications Engineering from UIET, Kurukshetra University, and a Master of Technology (M.Tech.) in V.L.S.I Design from Thapar Institute of Engineering and Technology. Her academic background supports her expertise in pixel design for CMOS image sensors.
Background
Neha Priyadarshini began her educational journey at The Shri Ram School, Gurgaon, where she completed her I.C.S.E. Board education, achieving top marks in Biology and Chemistry. Following her schooling, she pursued higher education in engineering, culminating in her current doctoral studies. Prior to her role at onsemi, she worked as a Project Assistant at the Indian Institute of Technology, Delhi, and completed an internship at the Delhi Metro Rail Corporation Ltd.
Achievements
During her doctoral research, Neha developed a novel algorithm for low light imaging at the pixel level using circuit design techniques in a CMOS image sensor. This work demonstrates her innovative approach to addressing challenges in imaging technology. Additionally, she has hands-on experience in tape-outs and PCB fabrication related to camera IC design, further highlighting her technical skills in the field.