Nur Asmawati Husin
About Nur Asmawati Husin
Nur Asmawati Husin is a Diebond Process Engineer at ON Semiconductor in Malaysia, where she has worked since 2019. She specializes in die bond processes and has successfully led projects that significantly improved surface damage reduction.
Work at ON Semiconductor
Nur Asmawati Husin currently serves as a Diebond Process Engineer at ON Semiconductor, a position she has held since 2019. In this role, she specializes in die bond processes, including epoxy, soft solder, and eutectic die attach. She utilizes various equipment such as ASM890A and SHINKAWA SPA500. Previously, she participated in the Engineer Rotation Programme at ON Semiconductor from 2018 to 2019, where she worked as an ERP Engineer for one year in Malaysia.
Education and Expertise
Nur Asmawati Husin has a solid educational background in engineering. She obtained her Bachelor’s Degree in Chemical Engineering from Universiti Kebangsaan Malaysia, completing her studies from 2013 to 2017. Prior to this, she pursued a Foundation in Science at UiTM Puncak Alam from 2012 to 2013. Her early education was completed at MRSM Tun Ghafar Baba, where she achieved her High School diploma from 2010 to 2011.
Background
Nur Asmawati Husin has developed her career in the semiconductor industry, focusing on die bond processes and quality control. She has experience in performing Measurement System Analysis (MSA) for Die Shear Tester and Gram Gauge, ensuring accurate measurements. Her responsibilities include managing quality controls and documentation, such as Control Plans and FMEA, and engaging in production line audits to maintain compliance with quality standards.
Achievements
Nur Asmawati Husin has successfully led a DMAIC SOSM Die Surface Damage Continuous Improvement project, resulting in over a 50% reduction in surface damage. She is actively involved in the qualification of new epoxy through process characterization and design of experiments (DOE). Additionally, she plays a crucial role in managing Lot On Hold (LOH) processes and collaborates with cross-functional teams to enhance these processes.