Olaf Zschieschang
About Olaf Zschieschang
Olaf Zschieschang is a Director of Package Technology at ON Semiconductor, specializing in the design and assembly process development for power semiconductor packages. He has over 30 years of experience in the field, having previously worked at IXYS Corporation and Fairchild Semiconductor.
Work at ON Semiconductor
Olaf Zschieschang has been serving as the Director of Package Technology in Corporate Research and Development at ON Semiconductor since 2016. His role involves overseeing the design and assembly process development for power semiconductor packages. This position allows him to leverage his extensive experience in the semiconductor industry to enhance product performance and reliability.
Experience at IXYS Corporation
Prior to his current role, Olaf Zschieschang worked at IXYS Corporation for 20 years, from 1992 to 2012. During his tenure in Lampertheim, Germany, he focused on Power Module Development. This experience contributed significantly to his expertise in power semiconductor technologies.
Role at Fairchild Semiconductor
In addition to his position at ON Semiconductor, Olaf Zschieschang has been the Director of Packaging at Fairchild Semiconductor since 2012. His responsibilities include managing packaging strategies and innovations, which are crucial for the performance of semiconductor devices.
Education and Expertise
Olaf Zschieschang studied at the University of Applied Sciences Mittweida from 1986 to 1991, where he gained foundational knowledge in engineering. He specializes in Auslegung, Konstruktion und Aufbau-und Verbindungstechnik for power semiconductor components, which encompasses design, construction, and connection technology.
Background
Olaf Zschieschang is based in Sinsheim, Baden-Württemberg, Germany. His career spans several decades in the semiconductor industry, with a focus on power semiconductor packaging and development. His extensive background has positioned him as a knowledgeable leader in the field.