Peter Locke
About Peter Locke
Peter Locke is the Director of Unit Process Module Engineering at onsemi, having previously held leadership roles at GLOBALFOUNDRIES and IBM. He has extensive experience in semiconductor manufacturing and holds a PhD in Physical Chemistry.
Work at Onsemi
Peter Locke currently serves as the Director of Unit Process Module Engineering at Onsemi. He has held this position since 2023 and is based in Hopewell Junction, New York. In this role, he is responsible for overseeing engineering processes related to semiconductor manufacturing, contributing to the company's operational excellence.
Previous Experience at GLOBALFOUNDRIES
Before joining Onsemi, Peter Locke worked at GLOBALFOUNDRIES as the Director of Fab 10 Equipment Excellence from 2018 to 2023. During his five years at the East Fishkill, NY facility, he focused on enhancing equipment performance and operational efficiency within the fabrication environment. He also served as Lean Transformation Manager for Fab 9 and Fab 10 from 2015 to 2018.
Career at IBM
Peter Locke has an extensive background at IBM, where he worked from 2005 to 2012 as a Project Manager in CMP, Films, and Wets Engineering. He later took on the role of Lean Transformation Manager for Semiconductor Manufacturing Solutions, a position he has held since 2012. His tenure at IBM is marked by significant contributions to process improvement and innovation.
Education and Expertise
Peter Locke earned a Bachelor of Science degree in Chemistry from Hobart and William Smith Colleges, where he studied from 1984 to 1988. He furthered his education at Rensselaer Polytechnic Institute, obtaining a PhD in Physical Chemistry from 1990 to 1996. His academic background supports his expertise in semiconductor manufacturing and engineering processes.
Achievements and Patents
Throughout his career, Peter Locke has achieved notable recognition, including the Outstanding People Management Award at IBM in March 2005. He holds 22 patents and has been recognized with 6 IBM invention plateaus, reflecting his contributions to technological advancements, including the introduction of Cu Plating technology in June 1999.