Phuvern Raj Nagaratnan
About Phuvern Raj Nagaratnan
Phuvern Raj Nagaratnan is a Process Engineer at onsemi in Malaysia, specializing in continuous improvement initiatives in the die bond process. He holds a Bachelor of Engineering in Electrical and Electronics Engineering from Universiti Kebangsaan Malaysia and has a background in managing critical process documentation.
Work at Onsemi
Phuvern Raj Nagaratnan has been employed as a Process Engineer at Onsemi since 2022. In this role, he focuses on continuous improvement initiatives aimed at enhancing quality, yield, and reducing scrap in the die bond process. His responsibilities include managing and reviewing critical process documentation, such as Failure Mode and Effects Analysis (FMEA), Work Instructions (WI), Out of Control Action Plans (OCAP), and Control Plans. This ensures the robustness of processes within the organization.
Education and Expertise
Phuvern Raj Nagaratnan completed his Bachelor of Engineering in Electrical and Electronics Engineering at Universiti Kebangsaan Malaysia from 2016 to 2020. Prior to this, he attended Kolej Matrikulasi Johor for 10 months in 2015, where he prepared for higher education. His foundational education includes primary education at SK Undang Jelebu from 2004 to 2009 and secondary education at SMK Dato' Undang Musa Al-Haj from 2010 to 2014, where he specialized in the Science Stream.
Background
Phuvern Raj Nagaratnan's educational journey began with primary education at SK Undang Jelebu, followed by secondary education at SMK Dato' Undang Musa Al-Haj. He then pursued a matriculation program at Kolej Matrikulasi Johor, which prepared him for his engineering studies. His academic background laid the groundwork for his current role in process engineering, where he applies his knowledge in practical settings.
Continuous Improvement Initiatives
In his role as a Process Engineer, Phuvern Raj Nagaratnan is actively involved in continuous improvement initiatives. He focuses on enhancing quality, yield, and reducing scrap specifically in the die bond process. His contributions include supporting new material evaluations and engineering build requests, which are essential for innovation and process enhancement. He also assists in resolving customer and internal issues by implementing improvement actions to prevent recurrence.