Pui Leng Low
About Pui Leng Low
Pui Leng Low is a Material Engineer at ON Semiconductor, where he specializes in semiconductor packaging materials and advanced analytical techniques. He has a Master's degree in Materials Engineering from the University of Malaya and a Bachelor's degree in Chemistry from Purdue University.
Work at ON Semiconductor
Pui Leng Low has been employed as a Material Engineer at ON Semiconductor since 2020, contributing to the Phoenix, Arizona area. In this role, Low focuses on mold compound benchmarking analysis and material outgassing experiments to improve semiconductor packaging materials. Prior to this position, Low served as a Package Development Engineer at ON Semiconductor from 2016 to 2020 in Seremban, Negeri Sembilan, Malaysia, where similar responsibilities were undertaken.
Education and Expertise
Pui Leng Low holds a Master of Engineering (MEng) in Materials Engineering from the University of Malaya, which was completed from 2017 to 2020. Low also earned a Bachelor of Science (B.Sc.) in Chemistry from Purdue University, studying there from 2011 to 2014. Low specializes in advanced analytical techniques, including scanning electron microscopy (SEM), Fourier transform infrared spectroscopy (FTIR), and pyrolysis-gas chromatography/mass spectroscopy (GC-MS), particularly for semiconductor processing contamination analysis.
Background in Chemistry and Materials Engineering
Before joining ON Semiconductor, Pui Leng Low worked as an Assistant Chemist at Atotech Group from 2014 to 2016 in Kuala Lumpur, Malaysia. This role provided foundational experience in the field of materials and chemistry, which has been beneficial in subsequent positions. Low's educational background and professional experience have established a strong foundation in materials engineering and chemistry.
Technical Skills and Responsibilities
In the role of Material Engineer, Pui Leng Low conducts non-destructive screening of semiconductor devices utilizing CT X-ray and scanning acoustic tomography to identify delamination or voids. Additionally, Low performs ionic analysis of mold compounds and assembly packaging materials through aqueous extraction using ion chromatography (IC). These technical skills are essential for ensuring the quality and reliability of semiconductor products.