Rajiv Sheth
About Rajiv Sheth
Rajiv Sheth serves as the Vice President of Product and Test Engineering at onsemi, bringing extensive expertise in SOC productization and multi-embedded core integration. With a solid background in engineering and management, he has held various leadership roles at Texas Instruments over a span of nearly two decades.
Work at Onsemi
Rajiv Sheth serves as the Vice President of Product and Test Engineering at Onsemi, a position he has held since 2023. He is based in Richardson, Texas, United States. In this role, he focuses on the productization of System on Chip (SoC) products, particularly those with multi-embedded cores and feature integration, such as Digital Signal Processor (DSP) cores with integrated Dynamic Reconfiguration Protocol (DRP). His leadership in product and test engineering is aimed at advancing Onsemi's technological capabilities.
Education and Expertise
Rajiv Sheth holds a Bachelor of Science degree in Electrical and Electronics Engineering from New York University - Polytechnic School of Engineering. He furthered his education by obtaining a Master of Business Administration from the SMU Cox School of Business, specializing in Business Administration and Management. His expertise encompasses the productization of SoC products, new technology introduction, and development across various process nodes, including 90nm to 16nm.
Background in Texas Instruments
Rajiv Sheth has an extensive background with Texas Instruments, where he worked for nearly two decades in various engineering and management roles. He began his career as an Engineer from 1994 to 1999, then progressed to Senior Engineering Manager for the Wireless Terminals Business Unit from 1999 to 2009. He later held positions as Director of Product and Test Engineering Operations, Director of Test and Operations for Processors, and Director of Test and Operations for the Radar 81GHz Business Unit until 2023.
Achievements in Engineering Management
Throughout his tenure at Texas Instruments, Rajiv Sheth has demonstrated strong capabilities in customer engagement and interface during product development and high-volume ramp cycles. He has led initiatives in aggressive benchmarking of cost-reduction programs and has managed capacity and throughput across multiple factories. His experience includes extensive knowledge in RF radio products with multi-radio protocols, such as Bluetooth, GPS, and WLAN, integrated on a single chip.