Renato Lat Tosino
About Renato Lat Tosino
Renato Lat Tosino is a Wirebond Engineer with over 19 years of experience in the semiconductor industry, currently working at ON Semiconductor in Malaysia. He has a strong background in process engineering, specializing in wirebond process optimization and has previously held positions at Amkor Technology, STATS ChipPAC Ltd., and Advance Semiconductor Engineering.
Work at ON Semiconductor
Renato Lat Tosino has been employed at ON Semiconductor as a Wirebond Engineer since 2018. In this role, he focuses on wirebond process optimization and is involved in various aspects of semiconductor manufacturing. His responsibilities include evaluating and executing procedures to ensure product compliance with quality, yield, and cycle time requirements. He has contributed to the development of new materials and processes to align with technology roadmaps.
Previous Experience in Semiconductor Industry
Prior to his current position, Renato worked at Advance Semiconductor Engineering (ASE) as a Wirebond Process Development Engineer from 2014 to 2018. He also served as a Process Engineer at STATS ChipPAC Ltd. from 2010 to 2014. His career began at Amkor Technology, where he worked as a Maintenance Technician from 2004 to 2010. This extensive experience spans over 19 years in the semiconductor industry, emphasizing process engineering and continuous improvement.
Education and Expertise
Renato Lat Tosino earned a Bachelor of Science in Industrial Technology, majoring in Electronics, from the University of La Union. His studies took place from 2010 to 2014. This educational background provides a strong foundation for his expertise in electrical and electronics engineering, which he applies in his current and previous roles within the semiconductor sector.
Technical Skills in Wirebonding
Renato is experienced in operating a variety of KnS bonders, including models such as 8028, Maxum Std, Maxum Plus, Maxum Ultra, KnS Iconn, KNS ProCu, and KnS Elite. He is also proficient with the Eagle bonder series, including 60AP, Extreme Eagle, and Extreme Gocu. His specialization in wirebond process optimization utilizes statistically sound methods, including Design of Experiment, across various package types.
Process Optimization and Compliance
In his roles, Renato has demonstrated proficiency in evaluating, verifying, and executing procedures to ensure compliance with product requirements. His focus includes maintaining standards in quantity, quality, yield, and cycle time. He has been responsible for new material qualification and process development, aligning these efforts with evolving technology roadmaps in the semiconductor industry.