Richard Tan
About Richard Tan
Richard Tan serves as the Principal Package Development Engineer at ON Semiconductor, where he has worked since 2016. He has extensive experience in package design and engineering, having held various roles at several semiconductor companies over the past two decades.
Work at ON Semiconductor
Richard Tan has been employed at ON Semiconductor since 2016, currently holding the position of Principal Package Development Engineer. His role involves overseeing the development and design of packaging solutions for semiconductor products. Prior to his current position, he worked at ON Semiconductor in various capacities, including Senior Package Design Engineer from 2008 to 2012 and Staff Engineer - Package Design from 2012 to 2014. His extensive experience at the company spans over eight years, contributing to the advancement of packaging technologies in the semiconductor industry.
Education and Expertise
Richard Tan earned a Bachelor of Science degree in Mechanical Engineering from Cebu Institute of Technology, where he studied from 1996 to 2001. This educational background provides him with a solid foundation in engineering principles, which he applies in his current role as a Principal Package Development Engineer. His expertise encompasses package design and development, as well as project engineering, gained through various roles in the semiconductor sector.
Background in Semiconductor Industry
Richard Tan has a diverse background in the semiconductor industry, having worked for several notable companies. His career began at Fairchild Semiconductor as a Process Engineer from 2004 to 2007. He then transitioned to NXP Semiconductors as a Sensors BFG - Project Engineer for one year in 2007 to 2008. After that, he joined Allegro MicroSystems, LLC as an AIG Design Expert from 2014 to 2016. This varied experience has equipped him with a broad understanding of different aspects of semiconductor engineering and design.
Career Progression
Richard Tan's career progression reflects a steady advancement in the field of semiconductor engineering. He started as a Process Engineer at Fairchild Semiconductor and moved on to roles at NXP Semiconductors and Allegro MicroSystems. His tenure at ON Semiconductor has seen him rise through the ranks from Staff Engineer - Package Design to Senior Package Design Engineer, and now to Principal Package Development Engineer. This trajectory illustrates his commitment to professional growth and expertise in package development.