Ryan Chen
About Ryan Chen
Ryan Chen is a Staff Engineer specializing in External Manufacturing Operations at onsemi in Hsinchu City, Taiwan. He has a strong background in semiconductor packaging technologies and has held various engineering roles at Amkor Technology, Inc. and onsemi over several years.
Work at Onsemi
Ryan Chen currently holds the position of Staff Engineer in External Manufacturing Operation at onsemi, a role he has occupied since 2022. He operates out of Hsinchu City, Taiwan. In this capacity, he is involved in overseeing external manufacturing processes and ensuring operational efficiency. Prior to this role, he served as a Senior Operation Engineer at onsemi from 2019 to 2021, where he contributed to various engineering projects and initiatives.
Experience at Amkor Technology, Inc.
Ryan Chen has significant experience at Amkor Technology, Inc., where he worked in various engineering roles. He served as a Senior Process Engineer from 2015 to 2017 and later as a Senior Process Integration Engineer from 2017 to 2018 in Longtan District, Taiwan. Additionally, he led the Automotive product division for a period of nine months in 2018. His tenure at Amkor Technology provided him with a solid foundation in semiconductor manufacturing processes.
Education and Expertise
Ryan Chen earned his Bachelor's degree in Mechanical Engineering from National Taipei University of Technology, where he studied from 2009 to 2013. He furthered his education by obtaining a Master's degree in Mechanical Engineering from National Central University, completing his studies from 2013 to 2015. His academic background supports his expertise in semiconductor packaging technologies and failure analysis techniques, including SEM, EDS, FIB, and CSAM.
Professional Background
Ryan Chen has a diverse professional background that includes roles as an Assembly/Test process engineer, project leader, and operation engineer. His experience spans multiple facets of semiconductor manufacturing, where he has developed extensive knowledge in various packaging technologies such as WLCSP, BGA, CSP, SOIC, PDIP, and TSSOP. He has also worked on product applications involving DLP projectors, imager sensors, headlights, and non-imager sensors.