Ryan Legaspi
About Ryan Legaspi
Ryan Legaspi is a Principal Test Engineer at ON Semiconductor, specializing in analog and mixed-signal IC testing. He holds a Bachelor of Science in Electrical, Electronics and Communications Engineering from the Technological University of the Philippines and has extensive experience in test development and engineering.
Current Role at ON Semiconductor
Ryan Legaspi serves as a Principal Test Engineer at ON Semiconductor, a position he has held since 2020 in County Limerick, Ireland. In this role, he is responsible for developing automated test equipment (ATE) software and hardware solutions tailored for analog and mixed-signal integrated circuit (IC) testing. His work involves conducting hardware and software multi-site debugging, correlation, and gauge studies, as well as spike elimination. He focuses on improving test efficiency and reliability within the organization.
Previous Experience at ON Semiconductor
Ryan Legaspi has an extensive history with ON Semiconductor, having worked in various roles since 2005. He was a Factory Test Development Engineer from 2005 to 2010, followed by a position as Sr. Factory Test Development Engineer (Team Lead) from 2010 to 2011. He later served as a Staff NPD Test Development Engineer (Section Head) from 2014 to 2016, and as a Staff Test Development Engineer from 2017 to 2020. His roles included responsibilities in test development and team leadership, contributing to multiple projects aimed at enhancing operational efficiency.
Educational Background
Ryan Legaspi earned his Bachelor of Science degree in Electrical, Electronics, and Communications Engineering from the Technological University of the Philippines. His studies spanned from 1999 to 2004, providing him with a solid foundation in engineering principles and practices. This educational background has been instrumental in his career in test engineering and development.
Technical Skills and Expertise
Ryan Legaspi possesses advanced skills in multi-site test program coding utilizing Eagle ETS800/364/300/500 testers. He is experienced in multi-site hardware schematic entry using PADS Power Logic and is knowledgeable in PADS PCB layout and Gerber generation. His expertise extends to conducting device characterization, yield and Cpk analysis, and test time reduction, which are critical in ensuring high-quality outcomes in semiconductor testing.
Contributions to Projects
Throughout his career, Ryan Legaspi has been involved in various projects aimed at cost reduction, quality enhancement, and capacity improvement within business units at ON Semiconductor. His contributions include performing test time reduction and engaging in device characterization efforts, which support the overall efficiency and effectiveness of the testing processes in the organization.