Sonny Dipasupil
About Sonny Dipasupil
Sonny Dipasupil is a New Package Development Principal Engineer at ON Semiconductor, specializing in wirebonding within the semiconductor industry. He has extensive educational background in engineering, holding degrees in Electronics & Communications Engineering, Electrical and Electronics Engineering, and Computer Technology.
Work at ON Semiconductor
Since 2013, Sonny Dipasupil has held the position of New Package Development Principal Engineer at ON Semiconductor in Region IVA - Calabarzon, Philippines. In this role, he is responsible for conceptualizing, designing, simulating, and executing prototypes for new semiconductor package applications. He serves as the main contact person for Business Units, ensuring that customer requirements and specifications for new package development activities are clearly defined and met. His expertise in wirebonding positions him as a Subject Matter Expert within the semiconductor industry.
Education and Expertise
Sonny Dipasupil has a solid educational background in engineering. He earned a Bachelor of Science (BS) in Electronics & Communications Engineering from Saint Louis University (PH) from 1994 to 1998. He also studied at the Technological University of the Philippines in Talisay City, where he completed a Bachelor of Science (BS) in Electrical and Electronics Engineering from 2005 to 2008. Additionally, he studied Computer Technology/Computer Systems Technology at Cordillera College, achieving a Technical degree from 1998 to 2000. His education supports his expertise in utilizing APQP and Project Management methodologies for semiconductor package design and qualification.
Background
Sonny Dipasupil's professional journey in the semiconductor industry spans over two decades. His early education laid the foundation for his technical skills, which he has developed through various roles in engineering. His experience includes significant involvement in new package development, where he has honed his skills in wirebonding and project management. His role at ON Semiconductor has allowed him to engage with various business units, facilitating the alignment of customer specifications with engineering capabilities.
Achievements
In his role as New Package Development Principal Engineer, Sonny Dipasupil has contributed to the advancement of semiconductor packaging technologies. His responsibilities include the design and qualification of new semiconductor packages, showcasing his ability to lead complex engineering projects. His specialization in wirebonding further underscores his technical proficiency and commitment to innovation within the semiconductor field.