Suet Teng Go
About Suet Teng Go
Suet Teng Go is the Section Head of Automation and Vision Development at ON Semiconductor, where he has worked since 2009. He specializes in designing automated vision systems for semiconductor manufacturing and provides technical guidance to his team.
Work at ON Semiconductor
Suet Teng Go has been employed at ON Semiconductor since 2009, where they hold the position of Section Head in Automation and Vision Development. Over the course of 15 years, they have contributed significantly to the company's operations by providing technical guidance and support to team members and production processes. Their role involves addressing vision-related challenges within the manufacturing environment, ensuring efficient and effective production workflows.
Education and Expertise
Suet Teng Go earned a Bachelor's degree in Computer Science from Universiti Putra Malaysia, completing their studies from 2003 to 2006. This educational background has equipped them with the necessary skills and knowledge to excel in their field. Their expertise includes designing and developing PC-based automated vision systems tailored for the semiconductor industry.
Background in Automated Vision Systems
Suet Teng Go has extensive experience in the design and development of automated vision systems specifically for semiconductor applications. They have worked on post wire bond inspection, focusing on issues such as off bond, missing wire, and wire sway. This background allows them to effectively lead a team of seven development resources in creating automated solutions that enhance manufacturing processes.
Technical Skills and Programming Languages
In their role, Suet Teng Go utilizes various programming languages, including VB, C++, and C#. Their technical skills extend to employing image processing software such as Halcon, Cognex, Open eVision, and Euresys. This proficiency in programming and software tools supports their work in semiconductor final test automated visual inspection, which includes assessing package surface defects and conducting dimensional inspections.