Taekkeun Lee
About Taekkeun Lee
Taekkeun Lee is a Principal Packaging Engineer with extensive experience in the semiconductor industry, currently working at ON Semiconductor since 2016 and previously at Fairchild Semiconductor for 14 years. He holds a Master's degree in Mechanical Engineering from Kyungpook National University and possesses advanced skills in various engineering design and analysis tools.
Work at ON Semiconductor
Taekkeun Lee has been employed at ON Semiconductor as a Principal Packaging Engineer since 2016. He is based in Bucheon, Gyeonggi-do, Korea. In this role, he is responsible for leading packaging engineering initiatives and contributing to the development of semiconductor packaging solutions. His extensive experience in the field supports the company's objectives in advancing semiconductor technologies.
Previous Experience at Fairchild Semiconductor
Before his current role at ON Semiconductor, Taekkeun Lee worked at Fairchild Semiconductor for a total of 14 years. He served as a Principal Packaging Engineer from 2010 to 2016 and previously held the position of Packaging Engineer from 2000 to 2009. His long tenure at Fairchild allowed him to develop significant expertise in semiconductor packaging processes and technologies.
Education and Expertise
Taekkeun Lee earned a Master's degree in Mechanical Engineering from Kyungpook National University, where he studied from 1992 to 1999. His educational background provides a strong foundation for his work in semiconductor packaging. He possesses advanced skills in various engineering design and analysis tools, including Autodesk Inventor, ANSYS for mechanical analysis, and Moldflow for molding analysis.
Experience at Samsung LED
Taekkeun Lee briefly worked at Samsung LED as a Senior Packaging Engineer from 2009 to 2010. During his five-month tenure, he contributed to the development of packaging solutions in the LED sector. This experience added to his knowledge and skills in the semiconductor and electronics packaging fields.
Technical Skills in Semiconductor Packaging
Taekkeun Lee specializes in several technical areas relevant to semiconductor packaging. He employs Q3D for RLC extraction and utilizes Failure Mode and Effects Analysis (FMEA) to enhance the reliability of packaging solutions. His expertise in mechanical analysis and molding processes supports the development of efficient and effective packaging for power modules.