Ts Lim
About Ts Lim
Ts Lim is a Technical Staff Engineer at ON Semiconductor, specializing in material engineering and semiconductor packaging. He has over a decade of experience in the industry, having previously worked at Texas Instruments and National Semiconductor, where he contributed to significant advancements in packaging technology.
Work at ON Semiconductor
Currently, Ts Lim serves as a Technical Staff Engineer at ON Semiconductor, a position he has held since 2013. In this role, he has contributed to various projects and initiatives within the company. Notably, he led the introduction of fluxless vacuum reflow technology to the Malaysian semiconductor industry in 2017, enhancing the manufacturing processes for automotive and non-automotive products. His experience at ON Semiconductor spans over 11 years, during which he has developed expertise in semiconductor packaging and materials engineering.
Education and Expertise
Ts Lim earned a Master's Degree in Material Engineering from Universiti Sains Malaysia, completing his studies from 2003 to 2007. His educational background provides a strong foundation for his work in the semiconductor industry. He possesses expertise in environmental, health, and safety (EHS) requirements related to materials, including compliance with Material Safety Data Sheets (MSDS) and Restriction of Hazardous Substances (RoHS) regulations.
Background in Semiconductor Industry
Ts Lim has a substantial background in the semiconductor industry, having worked for several prominent companies. He was a Senior Advanced Package Development Engineer at National Semiconductor from 2007 to 2011, where he played a key role in developing the eFCOL package platform. He also worked at Texas Instruments in various roles, including Senior Packaging Engineer and Senior Equipment Engineer, contributing to packaging and equipment engineering from 2011 to 2013.
Achievements in Technology Development
Throughout his career, Ts Lim has made significant contributions to technology development in the semiconductor sector. He conducted a direct material study in 2008 that focused on the effects of ultra-low stress compounds on package stress sensitivity. In 2009, he introduced a low-cost substrate with OSP as a replacement for ENIG substrate. Additionally, he received the Technical Excellent Award for publishing three internal technical papers and filing a US patent for an embedded stack die solution within two years.
Mentorship and Coaching
Ts Lim actively engages in mentorship and coaching within the semiconductor industry. He provides guidance to new line setups and introductions in sister plants, sharing his extensive knowledge and experience with emerging professionals. His commitment to mentoring helps foster talent and innovation in the field.