Vemmond Ng
About Vemmond Ng
Vemmond Ng is a Senior Package Development Engineer at ON Semiconductor, with a background in mechanical engineering and extensive experience in package development and project management. He has contributed to various projects, including the development of Power Module Packages and has filed two patents in this field.
Current Role at ON Semiconductor
Vemmond Ng serves as a Senior Package Development Engineer at ON Semiconductor, a position he has held since 2019 in Shenzhen, Guangdong, China. In this role, he manages the development process for Power Module Packages, specifically focusing on PIM IGBT/Mosfet, overseeing the transition from design to mass production. His responsibilities include leading technical discussions and addressing issues related to press-fit applications and PCB challenges.
Previous Experience at ON Semiconductor
Vemmond Ng has extensive experience at ON Semiconductor, where he worked in various capacities. He began as a Package Development Engineer - Engineer I from 2017 to 2018, followed by a role as ERP Engineer (Engineer Rotation Program) from 2016 to 2017. He advanced to Package Development Engineer - Engineer II from 2018 to 2019. During his tenure, he contributed to charity and event initiatives and participated in the Young Engineer Rotation Program Boot Camp in 2016.
Education and Academic Background
Vemmond Ng studied Mechanical Engineering at Monash University Malaysia, where he earned his Bachelor's Degree from 2012 to 2015. His academic journey included participation in the Monash Science Club as Vice President from 2013 to 2014. He completed his high school education at the Australian International School Malaysia, graduating in 2011.
Involvement in Shell Eco-Marathon
In 2014, Vemmond Ng served as the Brakes and Wheel Department Head for the Urban Concept Category at the Shell Eco-Marathon Asia, held in Manila, Philippines. This role involved overseeing the design and functionality of braking and wheel systems for the competition, which challenges students to design energy-efficient vehicles.
Patents and Technical Contributions
Vemmond Ng has filed two patents related to Power Module packages, showcasing his contributions to the field of package development. He has also led technical and project development for the Next Generation SSDC Package at ON Semiconductor, addressing critical issues such as the 'snake/crack' void problem during the vacuum reflow process for SSDC packages.