Wei Chun Chao
About Wei Chun Chao
Wei Chun Chao is a Package Design Engineer with extensive experience in the semiconductor industry, currently serving as a Senior Package Design Engineer at Dialog Semiconductor in Taichung, Taiwan, since 2015.
Work at Onsemi
Wei Chun Chao has been employed at Onsemi as a Package Design Engineer since 2017. He works in Hsinchu County, Taiwan, contributing to the company's semiconductor packaging initiatives. His role involves designing and developing packaging solutions that meet industry standards and customer requirements.
Work at Dialog Semiconductor
Since 2015, Wei Chun Chao has served as a Senior Package Design Engineer at Dialog Semiconductor in Taichung, Taiwan. In this position, he is responsible for leading packaging design projects and ensuring that they align with technical specifications and market demands. His tenure at Dialog Semiconductor spans nine years.
Previous Experience at Powertech Technology, Inc.
Wei Chun Chao worked at Powertech Technology, Inc. as a Section Manager from 2011 to 2015. During his four-year tenure, he managed a team focused on semiconductor packaging processes. His leadership contributed to the efficiency and effectiveness of the section's operations.
Education and Expertise
Wei Chun Chao earned a Master of Engineering degree in Medical Engineering from National Cheng Kung University from 2003 to 2006. His educational background provides a strong foundation for his work in semiconductor packaging, combining engineering principles with medical technology applications.
Career at Amkor Technology and Unimicron
Wei Chun Chao briefly worked at Amkor Technology as a Senior Technical Program Manager for two months in 2015. Prior to that, he was a Senior Engineer at Unimicron from 2006 to 2007. These roles contributed to his expertise in technical program management and engineering within the semiconductor industry.