Wentao Qin
About Wentao Qin
Wentao Qin is a Materials Science and TEM Engineer at ON Semiconductor, specializing in microelectronics reliability. He has authored multiple papers, holds patents, and has received several awards for his contributions to the field.
Work at Onsemi
Wentao Qin has been employed at ON Semiconductor as a Materials Science / TEM Engineer since 2010. His role involves applying his expertise in materials science to enhance the reliability and performance of microelectronic devices. Based in Phoenix, Arizona, he has contributed to various projects and initiatives within the company, leveraging his extensive knowledge in the field.
Education and Expertise
Wentao Qin possesses a strong educational background in materials science, which underpins his work in microelectronics reliability. His expertise includes thermal stress effects and advancements in copper wire bonding. He has authored multiple research papers that contribute to the understanding of these areas, showcasing his commitment to advancing the field.
Background
Wentao Qin has a notable background in the field of materials science and microelectronics. He has been actively involved in research and development since at least 2010, focusing on reliability and failure analysis of electronic devices. His contributions to the field are recognized through his participation in international symposiums and his editorial roles.
Achievements
Wentao Qin has received several accolades for his contributions to materials science and microelectronics. He was awarded the Outstanding Paper award at the International Symposium of Testing and Failure Analysis (ISTFA) in 2015. Additionally, he chaired the Tutorial of Package Level Failure Analysis at ISTFA in 2020 and 2021. His work has also led to multiple patents in the United States and China.
Publications and Contributions
Wentao Qin has authored multiple papers on microelectronics reliability, focusing on critical aspects such as thermal stress effects and improvements in copper wire bonding. He contributed to the exchange paper presented at the European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) in Halle, Germany, in 2016. Furthermore, he served as an editor for the IEEE Transactions on Components, Packaging and Manufacturing Technology, specifically for sections on 'The Reliability of Advanced Microelectronic Packaging' in 2020.