Zi Ming Chang
About Zi Ming Chang
Zi Ming Chang is a Package Development Engineer at ON Semiconductor, specializing in power package design and mechanical dicing techniques for ultra-thin wafer technology. He holds a Bachelor's degree in Materials Engineering from the University of Malaya and has experience in material analysis using various analytical tools.
Current Role at ON Semiconductor
Zi Ming Chang serves as a Package Development Engineer specializing in Power Package at ON Semiconductor. He has held this position since 2018 and is based in Seremban, Malaysia. In this role, he focuses on the development of packaging solutions that enhance the performance and reliability of semiconductor devices. His work involves the design and optimization of various components critical to power packaging.
Previous Experience at ON Semiconductor
Before his current role, Zi Ming Chang worked as a Process Engineer Intern at ON Semiconductor for two months in 2017. This internship took place in Negeri Sembilan, Malaysia, where he gained practical experience in semiconductor processes and operations, contributing to his foundational knowledge in the field.
Education and Expertise
Zi Ming Chang earned a Bachelor's degree in Materials Engineering from the University of Malaya, where he studied from 2014 to 2018. His academic focus included the development of robust mechanical dicing techniques for ultra-thin wafer technology, equipping him with specialized knowledge that he applies in his current engineering role.
Technical Skills and Tools
In his engineering practice, Zi Ming Chang utilizes various analytical tools for material analysis, including Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDX), and Bruker Surface Profiler. He is also skilled in designing lead frames, dispenser block tooling, and copper clips using AutoCAD, which supports his work in package development.