Neil Calder
About Neil Calder
Neil Calder serves as the Regional VP of Engineering, IC Design at Ouster in Edinburgh, Scotland, where he leads a team focused on LiDAR and 3D imaging technologies. He has a strong background in integrated circuit design, having held various engineering roles at notable companies and institutions over the past two decades.
Work at Ouster
Neil Calder has been serving as the Regional VP of Engineering, IC Design at Ouster since 2021. His role involves managing a multidisciplinary research and development center that focuses on LiDAR and 3D imaging technologies. He leads a team of engineers responsible for developing and defining system specifications for integrated circuits. Calder's expertise in IC design is instrumental in advancing the company's technological capabilities.
Previous Experience in Engineering
Before joining Ouster, Neil Calder held several significant positions in engineering. He worked at Sense Photonics as the Director of Engineering and Innovation Centre General Manager from 2019 to 2021. Prior to that, he served as a Manager in IC Design at Sense Photonics for 10 months in 2018. His earlier roles include Senior Analog IC Design Engineer at Nujira Ltd and Gigle Networks, Broadcom, where he contributed to the design and development of integrated circuits.
Education and Expertise
Neil Calder holds a Master of Engineering (MEng) degree in Electrical and Electronics Engineering from the University of Glasgow, which he completed from 1996 to 2001. He also earned a Master of Science (MSc) in System Level Integration from the Institute for System Level Integration in 2002. His educational background provides a strong foundation for his extensive experience in integrated circuit design, particularly in 3D image sensing using Time-of-Flight (ToF) technology.
Research and Development Background
Calder's research background includes a position as a Research Associate at the University of Edinburgh, where he focused on CMOS Image Sensor Design from 2014 to 2018. His work involved managing external partners and site expansion at the Innovation Centre, showcasing his ability to lead multidisciplinary teams in innovative projects. His experience spans various aspects of IC design, including signal communications and power management.