Bill Rochowicz
About Bill Rochowicz
Bill Rochowicz is a Technical Program Manager at Backbone in Palo Alto, California, where he has worked since 2023. He has extensive experience in advanced electronics packaging for automotive and mobile devices, with a background in aerospace engineering.
Work at Backbone
Bill Rochowicz has been serving as a Technical Program Manager at Backbone since 2023. In this role, he is based in Palo Alto, California, and focuses on managing technical projects within the organization. His responsibilities include overseeing project timelines, coordinating with cross-functional teams, and ensuring that technical specifications are met.
Education and Expertise
Bill Rochowicz holds a Master of Science in Aerospace Engineering from the University of Southern California, which he completed in 1993. He also earned a Bachelor of Science in Aerospace Engineering from the Illinois Institute of Technology, graduating in 1991. His educational background provides a strong foundation for his work in advanced electronics packaging and aerospace applications.
Background
Bill Rochowicz has a diverse professional background in both aerospace and consumer electronics industries. He began his career at Hughes Space and Communications as a Staff Engineer and later worked at Motorola in various engineering roles, including Lead Mechanical Engineer and Mechanical Engineering Section Manager. His experience spans from designing advanced electronics packaging for automotive and mobile devices to managing projects in camera technology.
Professional Experience
Bill Rochowicz has held multiple significant positions throughout his career. He worked at Motorola Automotive / Mobile Devices in various capacities from 1996 to 2004, including Sr. Mechanical Engineer and Lead Mechanical Engineer. He later joined Motorola Mobile Devices as a Principal Staff Engineer and Mechanical Sourcing, before moving to Apple as a Camera EPM. Most recently, he worked at Facebook as a Technical Project Manager from 2020 to 2023.
Achievements in Electronics Packaging
Bill Rochowicz has extensive experience managing electronics packaging projects. His work includes overseeing production volumes that range from small-scale satellite electronics to high-volume mobile phone components. His focus on camera technology projects reflects his expertise in optical and imaging systems, contributing to advancements in the field.