Robert Daily
About Robert Daily
Robert Daily is a Senior Principal Engineer specializing in Assembly and Package Engineering with over two decades of experience in the semiconductor industry. He has held various engineering and management roles across multiple countries, demonstrating expertise in advanced packaging technologies and process control.
Work at Rambus
Robert Daily has been employed at Rambus since 2019, serving as a Senior Principal Engineer in Assembly and Package Engineering. In this role, he focuses on advanced semiconductor packaging technologies and contributes to the development of innovative solutions within the company. His extensive experience in the semiconductor industry enhances his ability to address complex engineering challenges.
Education and Expertise
Robert Daily holds a Bachelor of Science degree in Mechanical Engineering from Manuel S. Enverga University Foundation in Lucena. He possesses expertise in Failure Mode and Effects Analysis (FMEA) and Statistical Process Control (SPC), which are critical methodologies in the semiconductor industry. His skills also include advanced semiconductor packaging technologies such as FlipChip, 3DIC, and BGA.
Background
Robert Daily has over two decades of experience in the semiconductor industry, having worked in various engineering and management roles. His career began at Amkor Technology in the Philippines as a Maintenance Technician from 1997 to 2003. He has since held positions in Taiwan, Singapore, and Belgium, gaining diverse international experience in semiconductor packaging and engineering.
Career Progression
Throughout his career, Robert Daily has held multiple significant positions. After his initial role at Amkor Technology, he served as a Process Engineer from 2003 to 2010 in Taiwan. He then worked as a Senior Engineer at UTAC in Singapore for one year. Following this, he joined IMEC in Belgium as a Research and Development Engineer specializing in 3D and 2.5D Packaging from 2011 to 2015. He returned to Amkor Technology in various managerial roles before joining Rambus.
Achievements in Semiconductor Engineering
Robert Daily has a strong background in product development and thin film technologies related to semiconductors. His work in advanced packaging technologies and process integration has contributed to the advancement of semiconductor engineering. His roles have involved significant responsibilities in both engineering and management, showcasing his capability in the field.