Yu Cheng Liao
About Yu Cheng Liao
Yu Cheng Liao is a Technical Director System Architect at Rambus, with over 15 years of experience in digital IC design and SoC implementation. He has held various leadership roles at companies including Vertexcom Technologies, Generalplus Technology, and PLDA, and has a strong academic background with two Master's degrees from National Taiwan University.
Work at Rambus
Currently, Yu Cheng Liao serves as the Technical Director System Architect at Rambus, a position he has held since 2021. In this role, he focuses on low power MCU design, RFMCU, and PLC SoC integration. He is involved in the architecture definition and RTL development of PCIe Gen6 IP, contributing to the advancement of high-performance computing solutions. His responsibilities include overseeing technical projects and ensuring alignment with company objectives.
Previous Experience at Vertexcom Technologies
Yu Cheng Liao worked as Senior Director at Vertexcom Technologies, Inc. from 2015 to 2019. During his four years there, he was based in Hsinchu County, Taiwan. His role involved leading teams and managing projects related to digital IC design and SoC implementation, building on his extensive experience in the field.
Experience at Generalplus Technology Inc.
From 2001 to 2015, Yu Cheng Liao held the position of Director at Generalplus Technology Inc. in Hsinchu County, Taiwan. Over the course of 14 years, he contributed to various projects and initiatives, leveraging his expertise in digital IC design. His long tenure at the company reflects his commitment to advancing technology solutions.
Engineering Role at Texas Instruments
Yu Cheng Liao began his career as an Engineer at Texas Instruments, where he worked for one year from 2000 to 2001 in Taipei City, Taiwan. This role marked the start of his professional journey in the semiconductor industry, providing him with foundational experience in engineering and technology.
Educational Background
Yu Cheng Liao studied at National Taiwan University, where he achieved two Master's degrees in Electrical and Electronics Engineering and Solid State Physics from 1994 to 2000. His academic background has equipped him with a strong foundation in engineering principles and advanced technologies, which he has applied throughout his career in the semiconductor industry.