Ravinder Sachdeva
About Ravinder Sachdeva
Ravinder Sachdeva is a Reliability Engineer at Sandia National Laboratories with extensive experience in material science and semiconductor processes.
Professional Title
Ravinder Sachdeva serves as a Reliability Engineer at Sandia National Laboratories in Albuquerque, New Mexico, United States.
Current Role and Responsibilities
Ravinder Sachdeva has been working as a Reliability Engineer at Sandia National Laboratories since 2021. In this role, he manages the Reliability Lab and its technicians. His responsibilities include conducting reliability experiments to evaluate risks and performing statistical and reliability analysis using JMP.
Previous Work Experience
Before joining Sandia National Laboratories, Ravinder Sachdeva was employed at Skorpios Technologies, Inc. for several positions over a nine-year period. He served as Principal Reliability Engineer from 2018 to 2021, as Principal Process Engineer from 2015 to 2018, and as a Materials Scientist from 2012 to 2015. Prior to that, he worked as a Dry Etch Process Engineer at Intel Corporation from 2011 to 2012, as a Material Scientist Mentor at Stanford University Graduate School of Business from 2009 to 2011, as a Semiconductor Process Engineer at Lam Research from 2006 to 2009, and as an Electronic Packaging Engineer at Altera from 1997 to 1999.
Educational Background
Ravinder Sachdeva holds a Ph.D. in Material Science Engineering from the University of California, Berkeley, earned between 2001 and 2005. He also holds an M.S. in Material Science Engineering from the same institution, earned between 1999 and 2001. Additionally, he completed a B.S. in Mechanical Engineering/Material Science at the University of California, Berkeley, from 1994 to 1997.
Areas of Expertise
Ravinder Sachdeva's expertise includes failure mechanisms in opto-electronic devices, root cause analysis, and thin film deposition, diffusion, and characterization of semiconducting material silicon. He has extensive experience in optical, electronic, chemical, and structural material characterization techniques, including TEM, SIMS, SEM, EDX, and SRIM. His experience spans both front-end and back-end wafer fabrication processes.