William Hegge
About William Hegge
William Hegge is a Packaging Engineer at Sandia National Laboratories with a long history in process and packaging engineering roles in Albuquerque, New Mexico.
Title and Current Role
William Hegge is currently a Packaging Engineer at Sandia National Laboratories. He started this role in 2021 and is based in Albuquerque, New Mexico, United States.
Previous Experience at Skorpios Technologies, Inc.
Before joining Sandia National Laboratories, William Hegge worked as a Process/Packaging Engineer at Skorpios Technologies, Inc. from 2016 to 2020. He was based in Albuquerque, New Mexico during this time.
Experience at CTS Electronic Components
William Hegge also served as a Backend Process Engineer at CTS Electronic Components for two years, from 2012 to 2014. His role was based in the Albuquerque, New Mexico area.
Tenure at Optomec
From 2008 to 2012, William Hegge worked at Optomec as a Process Engineer. His responsibilities and projects there spanned a period of four years.
Long-term Role at Philips Semiconductors
One of William Hegge's notable periods of employment was at Philips Semiconductors, where he worked as a Process Engineer for two decades, from 1983 to 2003.
Educational Background
William Hegge studied Mechanical Engineering Technology at New Mexico State University and earned his Bachelor of Science degree. His academic tenure lasted from 1978 to 1983.