Qi Yao
About Qi Yao
Qi Yao is a Member of Technical Staff at KYOCERA SLD Laser, specializing in facet optical coating production for high power GaN-based laser diode light sources. He holds a Ph.D. in magnetic materials and has extensive experience in thin film process development and wafer fab production.
Work at KYOCERA SLD Laser
Qi Yao has been a Member of Technical Staff at KYOCERA SLD Laser since 2018. In this role, he focuses on the development and sustaining of facet optical coating production for high power GaN-based laser diode light sources. His responsibilities include ensuring the technical excellence of production processes and coordinating with multi-functional teams to ramp up high-volume production from research and development stages.
Previous Experience at WD
Before joining KYOCERA SLD Laser, Qi Yao worked at WD, a Western Digital company, as a Principal Process Engineer from 2011 to 2018. His role involved overseeing process engineering tasks and contributing to the development of production techniques in Fremont, California. His tenure at WD spanned seven years, during which he gained significant experience in wafer fabrication and process optimization.
Education and Expertise
Qi Yao earned his Bachelor's degree in Materials Engineering from Central South University, where he studied from 1998 to 2002. He furthered his education at the Institute of Metal Research, Chinese Academy of Sciences, achieving a Ph.D. in magnetic materials from 2002 to 2009. His academic background provides a strong foundation for his expertise in thin film process development and control.
Visiting Scholar Positions
Qi Yao has held visiting scholar positions at notable institutions. He worked at the Vienna University of Technology for two months in 2007, and later served as a visiting scholar at the University of Idaho from 2008 to 2010. These experiences contributed to his professional development and broadened his research capabilities in materials engineering.
Technical Skills and Experience
Qi Yao possesses over a decade of experience in wafer fabrication production, handling wafer sizes ranging from 2-inch to 8-inch. He is recognized for his technical excellence in ramping up high-volume production from research and development phases, demonstrating his ability to coordinate effectively with diverse multi-functional teams to achieve production goals.