Mariano Pennini
About Mariano Pennini
Mariano Pennini is a Software Engineer currently working at Spade in New York, where he has contributed to the development of a financial data enrichment API since 2022. He has a background in fintech infrastructure and has previously worked at Bloomberg LP and other notable organizations.
Work at Spade
Mariano Pennini has been employed at Spade as a Software Engineer since 2022. In this role, he has contributed to the development of a financial data enrichment API, which aims to enhance customer insights into transaction data. His work focuses on building banking infrastructure solutions that improve customer understanding of spending habits.
Previous Experience
Before joining Spade, Mariano worked at Bloomberg LP as a Software Engineer from 2019 to 2022. His experience also includes an internship at Tile as a Backend Software Engineering Intern in 2017, where he worked for two months. Additionally, he interned at PayPal for four months in 2016 as a Software Engineering Intern. Mariano's early career also includes roles at Johns Hopkins University, where he served as an Undergraduate Researcher from 2015 to 2016 and as a Course Assistant for Intermediate Programming in C/C++ in 2016.
Education and Expertise
Mariano Pennini holds a Master of Science in Computer Science from the Johns Hopkins Whiting School of Engineering. He completed this degree after earning his Bachelor's Degree in Computer Science from The Johns Hopkins University, where he studied from 2014 to 2018. His academic background has equipped him with expertise in fintech infrastructure, particularly in fraud detection and underwriting through advanced data analysis.
Technical Skills
Mariano specializes in fintech infrastructure, with a focus on developing solutions that enhance financial services. His technical skills include building banking infrastructure solutions that improve customer understanding of spending habits. He has experience in advanced data analysis, which supports his work in fraud detection and underwriting.