Kenny Huang
About Kenny Huang
Kenny Huang is a Senior Optical Packaging Engineer with over 15 years of experience in thermal management and finite element analysis. He has worked at notable companies such as Powertech Technology, Inc., OmniVision, and currently Synaptics Incorporated, utilizing various FEA tools for thermal and mechanical stress analysis.
Work at Synaptics
Kenny Huang has been employed at Synaptics Incorporated since 2017, where he holds the position of Senior Optical Packaging Engineer. His role involves overseeing the design and development of optical packaging solutions, focusing on thermal management and mechanical stress analysis. His contributions are integral to the advancement of Synaptics' product offerings in the electronic packaging sector.
Previous Experience
Before joining Synaptics, Kenny Huang worked at OmniVision as a Package Design Engineer from 2008 to 2017. During this nine-year tenure, he was responsible for various aspects of package design, further enhancing his expertise in electronic packaging. Additionally, he briefly worked at Powertech Technology, Inc. as a Senior R&D Engineer for eight months in 2008, gaining valuable experience in research and development.
Education and Expertise
Kenny Huang earned a Master's degree in Mechanical Engineering with a focus on CAE Lab from NYUST University, completing his studies from 2001 to 2003. His educational background laid the foundation for his extensive knowledge in thermal management and finite element analysis (FEA). With over 15 years of experience in the FEA field, he has developed a strong proficiency in utilizing various FEA tools, including ANSYS, Abaqus, LS-DYNA, Flotherm, and Icepak.
Thermal Management Experience
Kenny Huang possesses extensive experience in thermal management at the package, board, and system levels. His expertise includes conducting thermal and mechanical stress analysis in electronic packaging, which is critical for ensuring the reliability and performance of electronic devices. His work involves applying advanced FEA tools to evaluate and optimize thermal performance.
Industry Background
With a career spanning over 15 years in the electronic packaging industry, Kenny Huang has developed a strong foundation in various aspects of packaging engineering. His experience encompasses roles that focus on both design and analysis, allowing him to contribute effectively to the development of innovative packaging solutions.