Mihir Roy, MBA, Ph.D
About Mihir Roy, MBA, Ph.D
Mihir Roy, MBA, Ph.D, is an Engineering Manager in Packaging at Synaptics Incorporated and a Substrate Packaging Program Leader at Intel Corporation, with extensive experience in the semiconductor industry. He holds advanced degrees in Nanotechnology and Business Administration, and has a strong background in product design, technology leadership, and innovation.
Work at Synaptics
Mihir Roy has been serving as the Engineering Manager - Packaging at Synaptics Incorporated since 2015. In this role, he is responsible for overseeing packaging engineering initiatives and managing projects related to product development. His tenure at Synaptics spans nine years, during which he has contributed to the company's advancements in technology and product offerings. His leadership in engineering has been instrumental in driving innovation within the organization.
Current Role at Intel Corporation
Mihir Roy holds the position of Substrate Packaging Program Leader at Intel Corporation, a role he has occupied since 2011. He has been with Intel for a total of 13 years, working in Chandler, Arizona. In this capacity, he leads programs focused on substrate packaging, ensuring alignment with the company's strategic goals. His extensive experience in this area has positioned him as a key player in Intel's packaging initiatives.
Educational Background
Mihir Roy earned his Doctor of Philosophy (Ph.D.) in Nanodielectrics from Rensselaer Polytechnic Institute, where he studied from 2002 to 2005. Prior to that, he obtained a Master’s Degree in Nanotechnology with a focus on Optics from the School of Nanotechnology at the University at Albany between 2000 and 2002. Additionally, he completed a Master of Business Administration (M.B.A.) in Finance & Strategy at Solvay Brussels School in 1998. His diverse educational background supports his expertise in engineering and business.
Previous Experience at Intel Corporation
Before his current roles, Mihir Roy worked at Intel Corporation in various capacities. He served as an IC Packaging Core Competency Engineer from 2005 to 2007 and later as an IC Packaging Platform Integrator from 2007 to 2011. His responsibilities included integrating packaging platforms and contributing to core competency development within the company. This experience laid the foundation for his later leadership roles in packaging engineering.
Research Experience at Rensselaer Polytechnic Institute
Mihir Roy worked as a Graduate Student Research Assistant at Rensselaer Polytechnic Institute from 2002 to 2005. During this time, he engaged in research activities related to his doctoral studies, contributing to the field of material science and electrical engineering. His research experience provided him with a solid foundation in the principles of nanodielectrics, which he has applied throughout his professional career.