Richard Quinn
About Richard Quinn
Richard Quinn is a Sr. Package Design Engineer with extensive experience in high-speed circuit design and FPGA technology. He has worked at Synaptics since 2014 and has held positions at Triple Crown and Benchmark Electronics, demonstrating proficiency in various design software.
Work at Synaptics
Richard Quinn has been employed at Synaptics since 2014, serving as a Senior Package Design Engineer. In this role, he focuses on the development and optimization of packaging solutions for semiconductor products. His tenure at Synaptics spans a decade, during which he has contributed to various projects that enhance product performance and reliability.
Current Positions
In addition to his role at Synaptics, Richard Quinn works at Triple Crown as a Package Layout Engineer since 2021. He also holds a position at Benchmark Electronics as a PCB Designer, which he has maintained since 2019. Both roles are based in Arizona, where he applies his engineering skills to support the design and manufacturing processes in the semiconductor industry.
Education and Expertise
Richard Quinn studied at McClintock High School and furthered his education at Mesa Community College. He achieved proficiency in IC Layout using Cadence Virtuoso during his studies. His expertise includes high-speed circuit design and field-programmable gate arrays (FPGA), which are critical in modern electronic design.
Technical Skills
Richard Quinn possesses a range of technical skills relevant to package design and PCB layout. He is proficient in using Cadence APD, Cadence Allegro, and Altium for package design tasks. Additionally, he utilizes Solidworks and AutoCAD for various design purposes within the semiconductor sector, enhancing his capability to deliver effective engineering solutions.