Rios Li
About Rios Li
Rios Li is an Application Engineering Lead at Synaptics Incorporated, with a background in Electrical, Electronics, and Communications Engineering. He has extensive experience in FPGA prototyping and specializes in projected capacitance touch panel applications.
Current Role at Synaptics
Rios Li serves as the Application Engineering Lead at Synaptics Incorporated, a position he has held since 2017. In this role, he is responsible for overseeing application engineering projects and providing technical support to clients. His expertise in projected capacitance touch panel applications within TDDI SOC chips plays a crucial role in the development and implementation of innovative solutions. Li's leadership in application engineering contributes to the company's success in securing business with major OEMs in China.
Previous Experience at Synaptics
Prior to his current role, Rios Li worked as a Senior Application Engineer at Synaptics Incorporated from 2012 to 2017. During this five-year tenure in Taipei, he gained valuable experience in application engineering, focusing on technical support and customer engagement. His contributions during this period helped enhance the company's product offerings and strengthen relationships with clients.
Educational Background
Rios Li studied at National Taipei University of Technology, where he earned a Bachelor of Science (BS) degree in Electrical, Electronics and Communications Engineering from 2000 to 2002. He also obtained an Associate's degree in Electrical and Electronics Engineering from the same institution, completing his studies from 1995 to 2000. This educational foundation provided him with essential knowledge and skills applicable to his career in engineering.
Technical Expertise and Projects
Rios Li has extensive experience in FPGA prototyping for T-CON and Image Enhancement. He has also been involved in the development of Smart TV Box solutions with Android OS at ChungHwa Picture Tubes. His specialization in projected capacitance touch panel applications within TDDI SOC chips highlights his technical proficiency in advanced engineering projects. Throughout his career, he has accomplished 16 patent applications and published 4 papers, showcasing his contributions to the field of engineering.