Derek Lee
About Derek Lee
Derek Lee is a Staff Software Engineer currently working at Tackle.io in Boulder, Colorado. He has extensive experience in software engineering and management, having held various roles at companies such as HP Software, Squerb, and Mercury Interactive over a career spanning several decades.
Work at Tackle.io
Derek Lee currently serves as a Staff Software Engineer at Tackle.io, a position he has held since 2022. Prior to this role, he worked as a Senior Software Engineer at the same company from 2021 to 2022. His tenure at Tackle.io is marked by his contributions to software engineering projects within the organization, leveraging his extensive background in technology and development.
Previous Experience in Software Engineering
Derek Lee has a diverse background in software engineering, having held various positions across multiple companies. He worked at HP Software in several roles, including Senior Manager for R&D and QA from 2009 to 2013. He also served as Head of R&D at Squerb from 2013 to 2015 and as Director of R&D at Mercury Interactive from 2003 to 2006. His experience spans over two decades, showcasing his expertise in R&D and IT governance.
Education and Expertise
Derek Lee holds a Bachelor of Science in Materials Science and a Master of Science in Electrical Engineering from the University of California, Berkeley. He also earned a Bachelor of Science in Electrical Engineering and Computer Science from the same institution. His educational background provides a strong foundation for his career in software engineering and technology development.
Career Timeline
Derek Lee's career spans multiple roles and companies, beginning as a Software Engineer at Kintana from 1996 to 1997. He progressed to Development Manager at Kintana from 1997 to 2003, followed by various senior management positions at HP Software. He worked at Kapost as a Senior Software Engineer from 2015 to 2021. His career reflects a steady advancement in responsibilities and expertise in the software engineering field.