Dayun Yan
About Dayun Yan
Dayun Yan is a Postdoctoral Fellow at The George Washington University, specializing in semiconductor manufacturing and nanofabrication techniques. He has extensive experience in plasma etch and EUV lithography processes and currently works as an engineer at Tokyo Electron US.
Work at The George Washington University
Dayun Yan has been a Postdoctoral Fellow at The George Washington University since 2016, working under the supervision of Professor Michael Keidar. In this role, he has focused on semiconductor manufacturing and nanofabrication techniques. Prior to his postdoctoral position, he was a Ph.D. candidate at the same institution from 2013 to 2016, also under Professor Keidar's supervision. His academic journey at The George Washington University began when he was a Ph.D. student from 2012 to 2013, working with Professor Stephen Hsu.
Current Role at Tokyo Electron US
Since 2022, Dayun Yan has been employed as an Engineer, Process III, at Tokyo Electron US. In this capacity, he specializes in plasma etch, extreme ultraviolet (EUV) lithography, and multi-patterning technologies. His work is based in the Albany, New York Metropolitan Area, where he applies his expertise in semiconductor manufacturing processes.
Education and Expertise
Dayun Yan earned his Doctor of Philosophy (Ph.D.) in Mechanical Engineering with a focus on Plasma Engineering from The George Washington University, completing his studies from 2012 to 2016. Prior to this, he obtained a Master’s Degree in Mechanical Engineering from Tsinghua University, where he studied from 2007 to 2010. His educational background provides a strong foundation for his specialization in semiconductor manufacturing and nanofabrication techniques.
Specialization in Semiconductor Manufacturing
Dayun Yan specializes in semiconductor manufacturing and nanofabrication techniques. His expertise includes plasma etch and EUV lithography processes, which are critical in the development of advanced semiconductor devices. His work contributes to the advancement of patterning technologies, particularly in the context of modern semiconductor fabrication.