NXP Semiconductors
Andra Yung
Metrology Process Engineer
Fred Mostert
Senior Mixed Signal Design Engineer Automotive Power Amplifiers
Philip Pesses
Kurt Sievers
President And Chief Executive Officer
Sh AI Lendra Pratap Singh
Senior Engineer
Andrew Morton
Senior Principal Process Engineer
Mike Fuller
Package Engineering Technician
Aldo Caro
Mechanical Engineer
Daniel De Grasse
Embedded Software Developer
Tim Smith
Npi Process Technician
Gaurav Sharma
Senior Principal Packaging Engineer/Project Lead Package Innovation
Ruurd Elmans
Productie Medewerker